Solutions · Liquid Cooling
Factory-ready Gigabyte servers with Direct-to-Chip liquid loops or immersion-tank compatibility, for high-TDP processors and accelerators with less energy spent on cooling.
Direct-to-Chip (D2C)Single-phase immersionTwo-phase immersionTDP from 500 W to 1000 W+Lower PUE
Market landscape
Each new generation of CPUs and GPUs dissipates more heat per chip. In many racks, air cooling has reached its physical and energy limits.
Processors and accelerators from 500 W to over 1000 W generate heat that airflow cannot remove efficiently.
Fans and precision air conditioning consume much of the room's power without doing any processing.
To keep temperatures down with air, racks are left underused and data center space delivers less.
Hot chips lower their frequency to protect themselves, and the expected performance never shows up under real load.
Engineering highlights
Direct-to-Chip
Cold plates on the CPU and GPU carry heat straight from the chip to the liquid loop.
Immersion
Servers submerged in a dielectric fluid that circulates and exchanges heat without changing state.
Immersion
The fluid boils on contact with the components and condenses, removing large amounts of heat.
Efficiency
Less energy spent on fans and air conditioning for the same processing load.
Power
Support for processors and accelerators from 500 W to over 1000 W.
Factory
Gigabyte chassis with factory-installed liquid loops or immersion-tank compatibility.
Recommended hardware
Factory-ready chassis with liquid loops or immersion-tank compatibility.
For channels and resellers
Strategic partnership with Giga Computing and access to Gigabyte platforms with factory liquid cooling.
Technical support for thermal and electrical sizing: cooling technology, power per rack and data center infrastructure.
Stock availability and invoicing through the distributor to speed up the reseller's project closing.
Project quote
Describe your scenario and a technical specialist will get back to you with the recommended configuration.
